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    Leading the way to
    next generation reticle technology

    As the semiconductor industry migrated from 0.18um process technology to 90nm process technology , TCE provided photomask solutions that assisted customers in meeting the complex challenges of these new technologies. Now, as the industry moves toward even more advanced process technology, TCE is providing customers with the knowledge, resources, products, and solutions necessary for success at the sub 100-nanometer level.

    Today, TCE is one of only a handful of Asian-based photomask providers offering mass production of reticles at 90 nanometer process node and research, development and test production of reticles at 65 nanometer process node. TCE and parent company Toppan have made continual investments in advanced E-beam writers, and own and operate state-of-the-art JBX3030 and EBM4000 E-beam writers. These devices will help TCE's mass production of 90 nanometer node and facilitate development of advanced photomask solutions at 65 nanometer process node.

    In addition, TCE is actively applying strong phase-shift mask(PSM) know-how for high-end photomask production; technology which tightens the critical dimension and gives customers a wider process window. TCE's expertise in strong PSM know-how is helping customers achieve more effective yields for subwavelength microlithography.

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